Customization: | Available |
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Metal Coating: | Copper |
Mode of Production: | SMT |
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Technical Capability | ||
NO. | Item | Capability |
1 | Base Material | FR4,High TG FR4,Aluminum,Rogers ,CEM-3,CEM-1,etc. |
2 | Layer | 1~20 |
3 | Board Thickness | 0.3mm~3.5mm |
4 | Board Thickness Tolerance (>0.1mm) | ±0.1mm |
5 | Finished Outer Copper Thickness | H/H0Z-5/50Z |
6 | Finished Inner Copper Thickness | H/H0Z-4/40Z |
7 | Min Board Size | 8*8mm |
8 | Max Board Size | 650*610mm |
9 | Min Line Width/Space | 2.5/2.5mil |
10 | Min Hole Size | 0.2mm |
11 | Hole Tolerance | ±0.05mm |
12 | Solder Mask | Green,Red, Blue,White,Black,Yellow, etc. |
13 | Surface Finish | HASL,HASL Lead Free,OSP, Immersion/ENIG,Gold-plating/Goldfinger, etc. |
14 | Min S/M Bridge | 3mil |
15 | Character Width (Min) | 0.15mm |
16 | Character Height (Min) | 0.85mm |
17 | Certificate | ISO,CQC,IATF,UL,ROHS |
18 | Value-added Service | Layout |
19 | Packing | Vacuum package |
20 | Application | Consumer electronics,Electric vehicle,Telecom devices, Industrial machine,Power supply, LCD modules,Instrument, Medical equipment,Education and development, etc. |